Home > Chip > 2013
  MSM

Technology
Chip Size
Power Supply
Function
Key Accelerators

Power Consumption
Released Date

0.13 μm 1P8M CMOS Process
2.35 mm x 5.0 mm
3.3V(IO), 0.7-1.0V(Core)
EEG Signal Processing, Transcranial Electrical Stimulation
Independent Component Analysis (ICA), Fast Fourier Transform (FFT),
Support Vector Machine (SVM)
4.45mW
Aug. 2013

 
  Gluco Scope2

Technology
Chip Size
Power Supply
Function
Key Block

Power Consumption
Released Date

0.18um 1P6M CMOS Process
2.5 mm x 5.0 mm (including pads)
1.5V
Non-invasive Blood Glucose Level Estimation
Impedance Spectroscopy Circuit,
Multi-wavelength Near-infrared Spectroscopy Circuit
Maximum 38mW
Aug. 2013

 
  Biocle5

Technology
Chip Size
Power Supply
Function
Modulation
Channel Frequency
Sensitivity
Power Consumption
Released Date

0.13 μm CMOS Technology
2.5 mm x 5.0 mm
1.2 V
Human Body Communication (HBC) Network Coordinator
Frequency Selective Digital Transmission (FSDT)
21 MHz (5.25 MHz Bandwidth)
-98 dBm @ 124 kbps
33 W/nodes
Aug. 2013

 
  SEIT

Technology
Chip Size
Power supply
Function
Sensitivity
Injectable Current
THD
Power Consumption
Released Date

0.18 μm 1P6M CMOS Technology
2.5 mm x 5.0 mm
1.8 V
Electrical Impedance Tomography (EIT)
4.9 m
10-400 μAp-p (0.1-100 kHz)
0.2% @ 200 μAp-p
53.4 mW (USB Supply)
Aug. 2013

 
  BONE-AR

Technology
Chip Size
Function
Frequency(Nominal)
Peak Performance
Power Dissipation
Area Efficiency
Power Efficiency
Per-frame Energy
Released Date

65nm 1P8M CMOS Process
4.0 mm x 8.0 mm
Markerless Augmented Reality
250 MHz (Digital)
1.22 TOPS
381 mW
38.13 GOPS/mm2
1.57 TOPS/W
12.70 mJ/frame
Jun. 2013

 

#1233, School of Electrical Engineering, KAIST, 291 Daehak-ro (373-1 Guseong-dong), Yuseong-gu,
Daejeon 34141, Republic of Korea / Tel. +82-42-350-8068 / Fax. +82-42-350-3410 / Mail: sslmaster@kaist.ac.kr
Copyright (C) 2017, SEMICONDUCTOR SYSTEM LAB., All Rights Reserved.