본문 바로가기
로그인

CHIP

Semiconductor System Lab

Through this homepage, we would like to share our sweats, pains,
excitements and experiences with you.

CHIP 2009

CHIP 목록
Image Title Specifications

2009

BONE-V4

Technology

Chip Size

Function

Operating Frequency

Power Supply

Power Consumption

Released Date

0.13 μm 1-P 8-M CMOS Technology

5 mm x 10 mm

Object Recognition

50~200MHz (PEs) / 400MHz (NoC)

1.2V

345mW

Aug. 2009

2009

BONE-V4

Technology

Chip Size

Function

Operating Frequency

Power Supply

Power Consumption

Released Date

0.13 μm 1-P 8-M CMOS Technology

5 mm x 10 mm

Object Recognition

50~200MHz (PEs) / 400MHz (NoC)

1.2V

345mW

Aug. 2009

2009

SmartProbe

Technology

Chip Size

Function

Sensitivity

Injectable current

SNR

CMRR

Power Consumption

Released Date

0.18 μm CMOS Technology

5 mm x 5 mm

ECGs/Bio-Impedance monitoring sensor

3.17V/ohm for 0.1ohm

100uAp-p-250uAp-p (90kHz sinusoidal)

>40dB with input noise < 1mohm/srtHz

TIV=91dB, ECG=78dB

3.9mW for communication, 2.4mW for sensing

Aug. 2009

2009

SmartProbe

Technology

Chip Size

Function

Sensitivity

Injectable current

SNR

CMRR

Power Consumption

Released Date

0.18 μm CMOS Technology

5 mm x 5 mm

ECGs/Bio-Impedance monitoring sensor

3.17V/ohm for 0.1ohm

100uAp-p-250uAp-p (90kHz sinusoidal)

>40dB with input noise < 1mohm/srtHz

TIV=91dB, ECG=78dB

3.9mW for communication, 2.4mW for sensing

Aug. 2009

Address#1233, School of Electrical Engineering, KAIST, 291 Daehak-ro (373-1 Guseong-dong), Yuseong-gu, Daejeon 34141, Republic of Korea
Tel +82-42-350-8068 Fax +82-42-350-3410E-mail sslmaster@kaist.ac.kr·© SSL. All Rights Reserved.·Design by NSTAR