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CHIP

Semiconductor System Lab

Through this homepage, we would like to share our sweats, pains,
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CHIP 2005

CHIP 목록
Image Title Specifications

2005

Biocle, Clearphone

Technology

Chip Size

Function

Operating Frequency

Power Supply

Power Consumption

Released Date

0.18 μm DongbuAnam CMOS Technology

5 mm x 5 mm

Body-Coupled PHY Transceiver, Digital Hearing Aid

160MHz, 32kHz

0.9V, 0.9V

2.6mW, 96μW

Dec. 2005

2005

Biocle, Clearphone

Technology

Chip Size

Function

Operating Frequency

Power Supply

Power Consumption

Released Date

0.18 μm DongbuAnam CMOS Technology

5 mm x 5 mm

Body-Coupled PHY Transceiver, Digital Hearing Aid

160MHz, 32kHz

0.9V, 0.9V

2.6mW, 96μW

Dec. 2005

2005

BioMAP

Technology

Chip Size

Function

Memory

Operating Frequency

Power Supply

Power Consumption

Released Date

0.18 μm DongbuAnam CMOS Technology

5 mm x 5 mm

Body Sensor Network management

768 Kb SRAM

4.2MHz for system bus, 8.192~32.768kHz for Sensor Management

0.6 V core, 0.6 V-1.8 V peripheral

24.2 μW avg

Dec. 2005

2005

BioMAP

Technology

Chip Size

Function

Memory

Operating Frequency

Power Supply

Power Consumption

Released Date

0.18 μm DongbuAnam CMOS Technology

5 mm x 5 mm

Body Sensor Network management

768 Kb SRAM

4.2MHz for system bus, 8.192~32.768kHz for Sensor Management

0.6 V core, 0.6 V-1.8 V peripheral

24.2 μW avg

Dec. 2005

2005

Logarithm Arithmetic Unit (LAU)

Technology

Chip Size

Gate Count

Function

Operating Frequency

Latency/Throughput

Power Supply

Power Consumption

Released Date

0.18 μm DongbuAnam CMOS Technology

1 mm x 1 mm (core) / 4 mm x 4 mm (die, pad limited)

9 K

Logarithmic Arithmetic Unit

213 MHz

2-cycle/1-cycle

1.8 V

2.18 mW (1-operand) / 3.07 mW (2-operand)

Mar. 2005

2005

Logarithm Arithmetic Unit (LAU)

Technology

Chip Size

Gate Count

Function

Operating Frequency

Latency/Throughput

Power Supply

Power Consumption

Released Date

0.18 μm DongbuAnam CMOS Technology

1 mm x 1 mm (core) / 4 mm x 4 mm (die, pad limited)

9 K

Logarithmic Arithmetic Unit

213 MHz

2-cycle/1-cycle

1.8 V

2.18 mW (1-operand) / 3.07 mW (2-operand)

Mar. 2005

2005

RamP-C2

Technology

Chip Size

Gate Count

Function



Clock Frequency

Pixel Fill Rate

Power Supply

Power Consumption

Released Date

0.18 μm DongbuAnam CMOS Technology

5 mm x 5 mm

330 KGate+164 Kb embedded SRAM

- Gouraud Shading
- Texture Mapping / Blending
- Pixel Alpha Blending

10 MHz

20 Mpixels/s

1.8 V (Core) / 3.3 V (I/O)

< 17.2 mW

Mar. 2005

2005

RamP-C2

Technology

Chip Size

Gate Count

Function



Clock Frequency

Pixel Fill Rate

Power Supply

Power Consumption

Released Date

0.18 μm DongbuAnam CMOS Technology

5 mm x 5 mm

330 KGate+164 Kb embedded SRAM

- Gouraud Shading
- Texture Mapping / Blending
- Pixel Alpha Blending

10 MHz

20 Mpixels/s

1.8 V (Core) / 3.3 V (I/O)

< 17.2 mW

Mar. 2005

2005

Body Channel Tester, RFID+Sensor, Bandgap Reference

Technology

Chip Size

Function



Clock Frequency



Power Supply

Power Consumption

Released Date

0.18 μm DongbuAnam CMOS Technology

2 mm x 2 mm

- Human Body Communication
- Pixel Alpha Blending
- RF Powered Sensors(Temperature and Photo Sensor)
- 1MHz (Body Channel Communication)
- 40KHz (RFID+Sensor)
- N/A (Bandgap Reference)

1 V/ 1.5-2.5 V / N/A

250 μ W/ 5 μ W / N/A

2005

Body Channel Tester, RFID+Sensor, Bandgap Reference

Technology

Chip Size

Function



Clock Frequency



Power Supply

Power Consumption

Released Date

0.18 μm DongbuAnam CMOS Technology

2 mm x 2 mm

- Human Body Communication
- Pixel Alpha Blending
- RF Powered Sensors(Temperature and Photo Sensor)
- 1MHz (Body Channel Communication)
- 40KHz (RFID+Sensor)
- N/A (Bandgap Reference)

1 V/ 1.5-2.5 V / N/A

250 μ W/ 5 μ W / N/A

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