2001
Fully Differential CMOS TIA
Technology
Chip Size
Function
Clock Frequency
Power Supply
Power Consumption
Released Date
0.25 μm Anam CMOS & Telephus Multichip-on-Oxide Process
Technology
5 mm x 5 mm
0.13 mm x 0.16 mm
250 μ m x 350 μ m
Transimpedance amplifier
N/A
2.5 V
27 mW @ 1 Gb/s
Aug. 2001
|
2001
Fully Differential CMOS TIA
|
Technology
Chip Size
Function
Clock Frequency
Power Supply
Power Consumption
Released Date |
0.25 μm Anam CMOS & Telephus Multichip-on-Oxide Process
Technology
5 mm x 5 mm
0.13 mm x 0.16 mm
250 μ m x 350 μ m
Transimpedance amplifier
N/A
2.5 V
27 mW @ 1 Gb/s
Aug. 2001 |
2001
MPTC
Technology
Chip Size
Function
Clock Frequency
Power Supply
Power Consumption
Released Date
0.16 μm HynixCMOS DRAM Technology
15.6 mm x 7.5 mm
Multilevel Parallel Texture Cache
150 MHz
2.5 V
89 mW
May. 2001
|
2001
MPTC
|
Technology
Chip Size
Function
Clock Frequency
Power Supply
Power Consumption
Released Date |
0.16 μm HynixCMOS DRAM Technology
15.6 mm x 7.5 mm
Multilevel Parallel Texture Cache
150 MHz
2.5 V
89 mW
May. 2001 |
2001
4Gb/s CDR
Technology
Chip Size
Function
Clock Frequency
Power Supply
Power Consumption
Released Date
0.25 μm Dongbu CMOS Technology
0.9 mm x 1.0 mm
4-Gb/s Clock and Data Recovery(CDR)
Circuit performing 1:4 DEMUX
500 MHz
2.5 V
70 mW
May. 2001
|
2001
4Gb/s CDR
|
Technology
Chip Size
Function
Clock Frequency
Power Supply
Power Consumption
Released Date |
0.25 μm Dongbu CMOS Technology
0.9 mm x 1.0 mm
4-Gb/s Clock and Data Recovery(CDR)
Circuit performing 1:4 DEMUX
500 MHz
2.5 V
70 mW
May. 2001 |