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CHIP

Semiconductor System Lab

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excitements and experiences with you.

CHIP 2001

CHIP 목록
Image Title Specifications

2001

Fully Differential CMOS TIA

Technology


Chip Size



Function

Clock Frequency

Power Supply

Power Consumption

Released Date

0.25 μm Anam CMOS & Telephus Multichip-on-Oxide Process

Technology

5 mm x 5 mm

0.13 mm x 0.16 mm

250 μ m x 350 μ m

Transimpedance amplifier

N/A

2.5 V

27 mW @ 1 Gb/s

Aug. 2001

2001

Fully Differential CMOS TIA

Technology


Chip Size



Function

Clock Frequency

Power Supply

Power Consumption

Released Date

0.25 μm Anam CMOS & Telephus Multichip-on-Oxide Process

Technology

5 mm x 5 mm

0.13 mm x 0.16 mm

250 μ m x 350 μ m

Transimpedance amplifier

N/A

2.5 V

27 mW @ 1 Gb/s

Aug. 2001

2001

MPTC

Technology

Chip Size

Function

Clock Frequency

Power Supply

Power Consumption

Released Date

0.16 μm HynixCMOS DRAM Technology

15.6 mm x 7.5 mm

Multilevel Parallel Texture Cache

150 MHz

2.5 V

89 mW

May. 2001

2001

MPTC

Technology

Chip Size

Function

Clock Frequency

Power Supply

Power Consumption

Released Date

0.16 μm HynixCMOS DRAM Technology

15.6 mm x 7.5 mm

Multilevel Parallel Texture Cache

150 MHz

2.5 V

89 mW

May. 2001

2001

4Gb/s CDR

Technology

Chip Size

Function


Clock Frequency

Power Supply

Power Consumption

Released Date

0.25 μm Dongbu CMOS Technology

0.9 mm x 1.0 mm

4-Gb/s Clock and Data Recovery(CDR)

Circuit performing 1:4 DEMUX

500 MHz

2.5 V

70 mW

May. 2001

2001

4Gb/s CDR

Technology

Chip Size

Function


Clock Frequency

Power Supply

Power Consumption

Released Date

0.25 μm Dongbu CMOS Technology

0.9 mm x 1.0 mm

4-Gb/s Clock and Data Recovery(CDR)

Circuit performing 1:4 DEMUX

500 MHz

2.5 V

70 mW

May. 2001

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